Service - Enabling Laser Material Processing R&D

Sparkle Optics Corporation supports Material Processing R&D at leading laboratories. Contact us at sales@sparkleoptics.com

Process Capabilities:

1. Dicing (Cutting, Singularization)
   • 0.39-mm silicon wafer at 18 mm/s (10 times faster than any UV laser)
   • 0.43-mm sapphire wafer at 5.8 mm/s (faster than any UV laser)
   • 0.4-mm PC Board at 20 mm/s (faster than any UV laser)


2. Scribing
   • Sapphire at 365 mm/s (faster than any UV laser)
   • Silicon at 340 mm/s (faster than any UV laser)


3. Hole Drilling (10 to 100 micron diameter)
   • Silicon, Sapphire, PC Board, Aluminum, Inconel, Stainless Steel, Polyester, Glass


4. Micro Welding
   • Aluminum, Stainless Steel


5. Surface Texturing for solar cell efficiency improvement
   • Silicon


6. Crack Repair


7. Laser Pumping


8. New Wavelength Laser Sources by Nonlinear Optics

Material Capabilities:

• Silicon Wafer
• Sapphire wafer
• PC Board
• Aluminum (Industrial and Aircraft Grade)
• Inconel
• Stainless Steel
• Plastic
• Ceramic
• Glass